Production Line
Process Capability
- Minimum part size: 01005
- Minimum IC pitch: 0.25 mm
- Minimum BGA ball diameter: 0.2mm
- Minimum BGA ball pitch: 0.25 mm
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最大PCB尺寸：550mm x 400mm
(No minimum size limit) - PCB types: single panel, double panel, multilayer board, aluminum substrate, flexible board (FPC)
Daily capacity
- SMT：1200萬點/天
- DIP: 100,000 points / day
- Group, test and package: 2 ~ 5 thousand sets / day
SMT
DIP
